Definitions:
Electronics, Soldering & PCB Terminology
We have compiled a glossary of definitions for Electronics, soldering and PCB terminology below. These are terms and acronyms frequently used throughout the Fraser Technologies website. These definitions have been designed as simple one sentence descriptions which may clarify some of the technical terms used on our website. However please don’t hesitate to contact us if you have any questions, which you feel are not answered sufficiently well.
A chemical applied during soldering that removes oxides and helps solder flow properly onto metal surfaces. Find out more about Soldering Fluxes
A mixture of tiny solder particles and flux used to attach components to a PCB in reflow soldering. Find out more about Solder Pastes
A wire of solder alloy (often with flux cored inside) used for hand soldering and rework. Find out more about Soldering Wires.
An oven that heats a PCB through a controlled temperature profile so solder paste melts and forms joints.
Removing dried solder paste and flux from printing stencils to keep paste deposits accurate on the next board.
A solder paste that contains no chlorine or bromine compounds, preferred for environmental and safety reasons. Find out more about Halogen-free Solder Pastes
How well molten solder flows over and adheres to a metal surface; good wetting produces strong, reliable joints.
A flux or paste property that helps prevent unwanted solder connections (‘bridges’) between closely spaced pads.
A flux designed to leave very little visible residue after soldering, often removing the need for post-solder cleaning.
Small droplets of solder that scatter during soldering; low-spatter wires reduce rework and mess.
Degradation of a soldering iron tip from use; good-quality wires slow this process and extend tip life.
Charged residue left on a PCB that can absorb moisture and cause corrosion or short circuits over time.
Cleaning that specifically targets microscopic solid particles (dust, fibres, skin flakes) that can cause failures.
The information set forth herein is furnished free of charge and based on technical data that Fraser Technologies believes to be reliable. It is intended for use by persons having technical skill, at their own risk. Since conditions of use are outside our control, we make no warranties, expressed or implied and assume no liability in connection with any use of this information. Nothing herein is to be taken as a license to operate under, or a recommendation to infringe any patents or patent applications.
Copyright © 2026 Fraser Technologies Ltd.
