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Soldering Pastes

High Reliability Soldering Pastes that perform

The Koki range of solder pastes includes products that solve your particular challenges, from pillowing and bridging to poor wetting and voiding. We can assist you with selecting lead–free, leaded or halogen-free soldering pastes with the required process performance and cleanability. The aim: repeatable solder joint quality and reliability.

High performance halogen free solder paste

Koki Solder Paste HF 1200 range

Koki S3X58-HF1200 solder paste

Halogen Free

The S3X58-HF1200 offers a versatile solution tailored to tackle critical assembly challenges such as voiding, wettability, flux splattering, printability, electrical reliability, and compliance with halogen-free standards. Its standout feature is the innovative ‘Dual 2-Step’ Enhancement technology, delivering outstanding soldering performance through a single, advanced formulation. 12 month shelf life (stored below 10°C)

Complies with Halogen Free standard (Cl+Br = 0ppm): BS EN14582

  1. Exhibits excellent print quality.
  2. >1 hour stencil idle time.
  3. Drastically reduces flux splattering.

Koki S3X58-HF1200 Halogen Free solder paste is ideal for applications requiring:

  • Powerful wetting
  • Low flux splattering
  • ICT testing/compatibility
  • NEW pin in paste applicable
  • Low voiding
  • Excellent printing
  • Extended tack time
  • Electrical reliability

Multi-feature Halogen-free Solder Paste for fine-pitch printing

Koki Solder Paste HF 1200 range

Koki S3X70-HF1200 solder paste

Halogen Free

The S3X70-HF1200 delivers optimal solderability with micro-components (0402 metric chip, 0.4mm pitch BGA, etc.). S3X70-HF1200 is a highly functional solder paste which can handle different soldering issues, such as void, wettability, flux splattering, printability and electrical reliability while complying halogen-free standard. ‘Dual 2-Step’ Enhancement technology, delivering outstanding soldering performance through a single, advanced formulation.  12 month shelf life (stored below 10°C)

Koki S3X70-HF1200 Halogen Free solder paste is ideal for applications requiring:

  • Powerful wetting
  • Low flux splattering
  • Ensures excellent solderability for micro components (0402 metric chips, 0.4mm pitch BGA) without the need for N2 reflow
  • Reduced manufacturing costs by switching from N2 to air atmosphere
  • Ultra Low voiding
  • Excellent printing
  • Halogen Free
  • Ultra-fine pitch performance with exceptional material stability

Cleanable-no-clean lead free solder paste

Koki S3X58-A230* solder paste

Halogen FreeProvides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.
  1. Unique properties successfully assure sufficient tack time of 24 hours.
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.
*Leaded versions also available offering even higher cleanability and lower melting points.

S3X58-A230 is ideal for soldering applications requiring:

  • Anti-pillow
  • Very easy clean no-clean
  • Low voiding
  • Lead free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

Remarkable wetting, anti-pillow, very low voiding

Koki S3X58-M500C-5 anti-pillow lead-free solder paste

Halogen FreeProvides powerful wetting to severely oxidised pads or components such as oxidized Cu substrate, oxidized Sn and NiPd plating.
  1. In tests, S3X58-M500C-5 demonstrated much longer heat durability of up to 50 seconds. In contrast, conventional solder paste lost activation in less than 30 seconds once it had started to melt.
  2. Delivers perfect melting and wetting performance at super fine pitch (>0.4mm pitch) and with micro components (>0.30mm diameter CSP, 0603 chip).

S3X58-M500C-5 is ideal for soldering applications requiring:

  • Ultra-low voiding
  • Anti-pillow
  • Powerful wetting
  • Lead free
  • Halide-free
  • Cleanable no-clean
  • >48-hours tack time
  • Fine-pitch/ultra-fine pitch

Outstanding printability solder paste

Koki S3X58-M406L-3

Halogen FreeSpecially engineered to ensure outstanding continual printability with super-fine pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications, and long stencil idle time.
  1. Offers perfect melting and wetting with ultra-fine-pitch and micro-components, as well as powerful wetting with metals including alloy42 and nickel.
  2. Very low voiding with CSPs and broad contact components assured by specially formulated flux chemistry.

S3X58-M406L-3 is ideal for soldering applications requiring:

  • Excellent printability
  • Anti-pillow formulation
  • High wettability
  • Lead-free
  • Halide-free
  • >72-hours tack time
  • Long stencil abandonment time >90 mins
  • Fine-pitch/ultra-fine pitch

Also available S3X58-M406ECO which does not require refrigerated storage

ICT compatible residue Solder Paste

Koki S3X58-M650-7 solder paste

Halogen FreeProvides exceptional cleanable, no clean performance, leaving behind no trace of flux residues on PCBs.
  1. Special flux residue remains flexible after reflow to prevent clogging of ICT test probe pins

TB48-M742 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • Halogen Free
  • Melting point 138-140 degC
  • Low voiding
  • Suitable for PET substrate
  • >24-hours tack time
  • Dispensable version also available TB48-M742D
  • Reduced power consumption resulting in reduced CO2 emissions

Low melting point solder paste

Koki TB48/TAB58-M742 solder paste

Halogen FreeProvides outstanding wetting and low voiding performance using a low melting point alloy
  1. Reflow oven temperatures can be kept to a minimum to protect temperature sensitive components and boards.
  2. Reduced oven temperatures significantly reduce CO2 emmissions due to reduced power consumption during processing

TB48-M742 is ideal for soldering applications applications requiring:

  • Anti-pillow
  • Halogen Free
  • Melting point 138-140 degC
  • Low voiding
  • Suitable for PET substrate
  • >24-hours tack time
  • Dispensable version also available TB48-M742D
  • Reduced power consumption resulting in reduced CO2 emissions

Anti-tombstone leaded alloy solder paste

Koki SSA48-M955 solder paste

Provides cleanable, no clean performance, with alloy designed to address tombstoning issues regularly associated with leaded alloys and in particular vapour phase reflow

  1. Cleanable using both aqueous and solvent based cleaning processes
  2. Offers maximum flexibility by being suitable for both clean and no-clean use.

SSA48-M955 is ideal for soldering applications requiring:

  • Anti-pillow
  • Anti tombstone alloy
  • Easy clean no-clean in both aqueous and solvent cleaning systems
  • Low voiding
  • Lead-free (leaded versions available)
  • >24-hours tack time
  • Fine-pitch/ultra-fine pitch

Get in Touch

As experts in the field, Fraser Technologies have a deep understanding of the challenges and opportunities facing our clients’ industries and sectors. Our insights and independent recommendations are based on over 55 years experience, and rigorous analysis of the options available to you.

 

24 Grange Road, Houstoun Industrial Estate, Livingston EH54 5DE
Tel: +44 (0)1506 443 058
Email: [email protected]

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