Electronics Cleaning Equipment
The cleaning of PCB assemblies can be performed using either aqueous or solvent based processes
These depend on a range of parameters (safety, chemistry, cleaning process, environment, substrate and soil type) as well as PCB design and reflow temperatures. Types of flux residue vary from process to process and even no-clean fluxes leave a residue. No single chemistry proves the answer for every situation. The aim is to achieve consistently clean PCB surfaces and under-component areas, free for unwanted flux and other residues – for reliability and repeatability.
Assembly cleaning processes using aqueous cleaning chemistries include:
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Aqueous batch cleaning – spray in air
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Aqueous batch cleaning – immersion
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Aqueous inline cleaning
Stencil cleaning using dedicated automatic equipment complements other stencil cleaning methods, including under-stencil wiping and manual or semi-auto cleaning to help avoid unwanted residue on stencils that can lead to print problems and defects. There are 4 main automatic cleaning processes:
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Immersion ultrasonic cleaning, water rinse
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Immersion ultrasonic cleaning, no rinse
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Spray-in-air, water rinse
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Spray-in-air, no rinse
Fraser Technologies can help ensure compatibility between chemistries, processes and equipment to ensure optimal cleaning results. New challenges are always on the horizon, and our aim is to meet the changing needs of the electronics sector and help deliver cost effective, safety-conscious and eco-friendly solutions.
The single chamber aqueous cleaning system is only 65cm wide, providing a large internal capacity within a small footprint. It offers a flexible chamber space, allowing a wide range of components to be cleaned quickly at the same time.
The machines are especially effective for flux removal from electronic PCB assemblies but are ideally suited for many other specialist cleaning applications as well.
- Smart load system for maximum user flexibility
- Intelligent controls – 40 programmable slots controlled through an integrated touch glass screen
- Efficient cleaning processes and high-grade stainless steel finish give enhanced longevity and reliability, with maximum particulate removal ensured by HEPA H14 fine filter
- Easy visual monitoring of chamber via full glass door and integrated chamber lighting
- Wide range of load carriers and 93 available accessories offer complete configurability for any size of load (up to 50L) offering maximum flexibility alongside ease of use
Application: electronics
- Soldering flux removal
- Unpopulated, populated or misprinted circuit boards and ceramic substrates
- Soldering frames, soldering masks and metal templates
Types of soiling:
- Milling dust, solder paste, flux residues and SMT adhesives
Cleaning requirements:
- Before populating
- After soldering
- After printing
- Before circuit tests
- Before lacquering
- After misprinting.
Application: Medical, glass and optical ware
- Coated and uncoated glass, e.g. moulded glass, safety glass, optical lenses
Types of soiling:
- Dust, glass dust, fingerprints, particles, lapping abrasives, polish, wax crayon
Cleaning requirements:
- Interim or final clean
- Before and after coating
Application: metal components
- Steel, stainless steel aluminium, copper, brass, diecast zinc, hard alloys
Types of soiling
- Oil, emulsions, polishes, metal particles, lapping abrasives
Cleaning requirements:
- Interim or final clean
- Before assembling or packing
- Before sticking, lacquering, welding, soldering
- Before setting
- Before coating (e.g. TiN and TiC)
Application: 3D printing and plastics
- Plastic components, magazines and transport containers
Types of soiling:
- Separating agent, dust, particles, oil
Cleaning requirements:
- Interim or final clean
- Before assembly or packing.
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As experts in the field, Fraser Technologies have a deep understanding of the challenges and opportunities facing our clients’ industries and sectors. Our insights and independent recommendations are based on over 55 years experience, and rigorous analysis of the options available to you.
