Extended Shelf Life of KOKI S3X58-HF1200: From 6 to 12 Months
KOKI has officially extended the shelf life of its no clean lead free S3X58-HF1200 solder paste from six months to twelve months, representing a rare and highly differentiated performance characteristic within the SMT solder materials market. Designed for high-reliability electronics and surface mount technology (SMT) assemblies, this extension offers measurable advantages in process stability, material utilisation, and inventory management, while maintaining the stringent performance standards required in advanced electronic manufacturing. A new updated Technical Data Sheet (TDS) is now available from Fraser Technologies, Koki’s sole UK partner, detailing the formulation enhancements and validated storage conditions that support this extended shelf life.
Halogen Free Solder Paste - now with 12 months shelf life!
Advancing Halogen-Free SMT Solder Paste Performance for High-Reliability Electronics
The S3X58-HF1200 represents a significant advancement within KOKI’s halogen-free solder paste portfolio, delivering consistently low voiding performance, stable print behaviour, and dependable electrical integrity. Engineered for automotive, industrial, and other high-reliability electronics applications, the formulation has been developed to meet demanding production and quality standards without compromise. Maintaining KOKI’s established halogen-free philosophy, S3X58-HF1200 combines proven soldering performance with enhanced material characteristics. This development also supports Fraser Technologies’ wider sustainability objectives, enabling manufacturers to achieve increasingly strict environmental compliance targets while preserving process reliability and operational efficiency.
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Koki S3X58-HF1200 Addressing Industry Challenges with Advanced Formulation:
With growing demands for high-performance PCB assembly and component quality, the Koki S3X58-HF1200 stands out by providing a multifunctional solution designed to address major assembly challenges, including voiding, wettability, flux splattering, printability, electrical reliability, and halogen-free requirements. Plus an extended shelf life of 12 months.
In particular, the ‘Dual 2-Step’ Enhancement technology ensures exceptional soldering performance – all within a single, advanced formulation.
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Low Void Performance:
The 2-Step Flux Gas Discharge Effect significantly reduces voids, even in challenging component designs such as bottom electrodes.
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Enhanced Print Stability for Faster Cycle Times:
The newly designed flux formulation maintains viscosity during long continuous use, ensuring shape retention and stable paste print deposit contour. This minimises issues such as slumping, smearing, and bleeding, reducing stencil cleaning frequency and shortening cycle times.
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Powerful Wetting:
The innovative 2-Step Activation Boost Effect provides exceptional solder spread across various surface finishes, matching the performance of halogen-containing pastes.
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High Electrical Reliability:
Ensures superior insulation resistance and compatibility with conformal coatings, making it suitable for high-reliability applications.
Koki S3X58-HF1200 Feature List:
- Solder alloy composition : Sn3.0Ag0.5Cu
- Realises low voiding with BTCs (e.g., Pw.Tr., QFN, LGA) and BGA
- Powerful wetting as good as Halogen containing solder paste
- Wide process window and enhanced flexibility of reflow profile design
- Exhibits excellent print quality response with >1hour stencil idle time
- Excellent stability of shape retention and contour of each printed paste deposit helps to reduce stencil cleaning frequency
- Complies with Halogen Free standard (Cl+Br = 0ppm): BS EN14582
- No artificial addition of any halogen element Flux type: ROL0 (Cl+Br+I+F = < 0.05% / IPC J-STD-004B/C/D)
- RoHS, REACH compliant product
- 1-year shelf life
The 'Dual 2-step'
2-Step Flux Gas Discharge Effect:
Step 1:
The technology designed to reduce voids by rapidly discharging flux through the Active Coagulation Effect
Step 2:
The Extended Active Outflow Effect continues to discharge any remaining voids, realising the lowest void performance ever achieved
2-Step Activation Boost Effect:
Step 1:
Activation Stabiliser Ensures solder paste stability for high print consistency.
Step 2:
High-Temperature Activation Boost enhances wetting performance for superior soldering results.
QFN Voiding Behaviour during reflow
View Koki’s video below a spotlight on the multi-feature Halogen- Free, Lead- Free HF1200 solder Paste featuring QFN voiding behaviour during reflow.
Specifications:
Material : Glass epoxy FR-4
Surface treatment : OSP
Stencil thickness : 0.12mm (laser cut)
Component: QFN (Sn plating)
Request the updated S3X58 – HF1200 TDS (Technical Data Sheet).
Soldering Applications
Explore Koki’s Full Range of Soldering Solutions
The S3X58-HF1200 continues Koki’s legacy of halogen-free innovation and is just one of many industry-leading soldering products available. Fraser Technologies is proud to offer a complete selection of Koki solder pastes, fluxes, and wires designed for a wide range of applications.
Click to explore the full Koki range and find the perfect solution for your assembly needs.
Fraser Technologies: Bringing You the Best in Soldering Innovation
At Fraser Technologies, we are delighted that the Koki S3X58-HF1200 no-clean, lead free solder paste, can now also boast an extended 12 month shelf life. Whether you need to reduce voiding, improve wettability, or optimise your overall assembly process, realising enhance print stability time-after-time, this solder paste offers a multifunctional solution that meets the evolving needs of modern electronics manufacturing.
Solder Paste
Interested in trying the Koki S3X58-HF1200 for your production?
Get in Touch
To discuss how this groundbreaking solder paste can enhance your production process get in touch today for technical brochures, product performance tables and you can also request a free sample, with technical and analytical support via Fraser Technologies. We offer product trials and personalised support.
